From Concept to Market: Your End-to-End Custom PCB Manufacturing Partner
MFGsourcing empowers small businesses to bridge the gap between design and mass production. We specialize in custom electronic product and PCB manufacturing, guiding you seamlessly through every critical phase: Engineering Validation Testing (EVT), Design Validation Testing (DVT), and Production Validation Testing (PVT). We transform your innovative ideas into reliable, high-quality products.
Our Meticulous PCB Fabrication & Assembly Process:
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DFM & Pre-Production Engineering: We begin with a thorough Design for Manufacturability analysis, identifying potential issues to optimize your design for cost, efficiency, and reliability before fabrication starts.
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Material Procurement & Inspection: We source high-quality, certified laminates (FR-4, Rogers, etc.) and components from vetted suppliers, with all materials undergoing incoming quality checks.
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Inner Layer Imaging & Etching: Your design is printed onto the inner layers of copper-clad laminate using photoresist, then etched away to form the intricate circuit traces.
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Lamination & Layer Bonding: Treated inner layers are stacked with prepreg (bonding material) and outer copper foils. This stack is fused under high heat and pressure into a single, multi-layered board.
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Drilling: Precision CNC machines drill the necessary through-holes and vias for inter-layer connections and component leads.
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Plating & Copper Deposition: The panel undergoes electroless and electrolytic copper plating to metallize the hole walls, establishing electrical connectivity between layers.
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Outer Layer Imaging & Pattern Plating: The outer layer circuitry is imaged and plated with copper and a protective tin layer.
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Final Etching & Strip: The exposed copper is etched away, leaving the protected tin-plated circuits intact. The tin is then stripped, revealing the final copper circuitry.
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Solder Mask & Silkscreen Application: A protective epoxy solder mask is applied (typically green), followed by the silkscreen legend for component identifiers.
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Surface Finish: The exposed copper pads receive a final finish (HASL, ENIG, Immersion Silver, or OSP) to ensure solderability and protect against oxidation.
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Electrical Testing & Route: Every board undergoes 100% electrical testing (Flying Probe or Fixture-based) to verify netlist connectivity. Boards are then routed from the production panel.
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Final Inspection & Packaging: A rigorous quality control inspection checks for defects before boards are carefully packaged and shipped.
Cost Optimization (VAVE): We employ Value Analysis/Value Engineering (VAVE) methodologies, analyzing your design and processes to suggest material alternatives, design simplifications, and efficiency improvements that reduce total cost without compromising quality.
Uncompromising Quality: Our systems are certified to ISO 9001 (Quality Management), IATF 16949 (Automotive), and ISO 13485 (Medical Devices), ensuring meticulous process control and traceability for demanding industries.
Comprehensive Testing: We offer a full suite of tests including In-Circuit Test (ICT), Flying Probe, Automated Optical Inspection (AOI), X-Ray Inspection (AXI), and functional testing to guarantee your products perform flawlessly.
Partner with MFGsourcing to launch your product with confidence.
