Your Global Partner for Advanced Multilayer PCBs
From initial concept to full-scale production, MFGsourcing delivers precision multilayer PCB fabrication for every stage of your product lifecycle: Engineering Validation (EVT), Design Validation (DVT), and Production Validation (PVT). We empower innovators in automotive, medical, and consumer electronics with robust, reliable boards built to the highest standards.
Our Detailed Manufacturing Precision:
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Design & DFM Analysis: Your Gerber/data intake triggers a comprehensive Design for Manufacturability check, ensuring optimal panelization and identifying potential issues before fabrication begins.
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Material Preparation & Inner-Layer Imaging: High-quality laminate is cut, and inner layers are cleaned. A photoresist is applied and exposed using your design data via laser direct imaging (LDI) for extreme accuracy.
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Etching & AOI: Unwanted copper is etched away, leaving the circuit pattern. Automated Optical Inspection (AOI) meticulously scans each inner layer for defects.
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Lamination & Pressing: Treated inner layers are stacked with pre-impregnated (prepreg) dielectric layers and copper foil. The stack undergoes a high-temperature, high-pressure lamination process to fuse into a solid multilayer board.
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Drilling: Precision CNC machines drill microvias, through-holes, and mounting holes with exceptional accuracy.
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Electroless & Electrolytic Plating: A thin layer of copper is chemically deposited onto the panel and drilled hole walls, followed by electrolytic plating to build up the thickness, establishing electrical connectivity between layers.
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Outer-Layer Imaging & Plating: The outer layers are patterned using LDI. They are then plated with copper and a protective tin finish.
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Etching & Strip: The exposed copper is etched away, leaving the final circuit traces protected by the tin resist.
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Solder Mask & Surface Finish: A liquid photoimageable solder mask (LPI) is applied, exposed, and developed to protect the board. Your chosen surface finish (ENIG, HASL, Immersion Silver, etc.) is applied to exposed pads.
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Silkscreen & Electrical Test: Component legends are printed. Every board undergoes 100% Electrical Testing (Flying Probe or Fixture Test) to verify netlist continuity and isolation.
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Final Routing & Quality Inspection: Boards are routed from the panel. A final manual and automated QC inspection ensures compliance before packaging and shipment.
Cost Optimization (VAVE): Our global supply chain and engineering expertise actively identify Value Analysis/Value Engineering opportunities—from material alternatives to panel optimization—reducing your cost without compromising quality.
Uncompromising Quality: Our processes are certified to ISO 9001 (Quality Management), ISO 13485 (Medical Devices), and IATF 16949 (Automotive), guaranteeing traceability and reliability for critical applications.
Rigorous Testing Suite: We offer Flying Probe/Fixture Testing, AOI, X-Ray (for microvias and BGAs), Ionic Contamination Testing, and First Article Inspection (FAI) reports.
Partner with MFGsourcing for a seamless journey from prototype to volume production. Contact us today for a competitive quote and expert DFM feedback.
