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High-Temperature Resistant Die Cut Adhesive Tape for Industrial Use

  • High-Temperature Resistant Die Cut Adhesive Tape for Industrial Use
  • High-Temperature Resistant Die Cut Adhesive Tape for Industrial Use
  • High-Temperature Resistant Die Cut Adhesive Tape for Industrial Use
  • High-Temperature Resistant Die Cut Adhesive Tape for Industrial Use
Model No.︰MGF-220825-2
Brand Name︰MFG
Country of Origin︰China
Unit Price︰US $ 0.7 / pc
Minimum Order︰3000 pc
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Product Description

MFGsourcing specializes in providing custom high-temperature resistant die-cut adhesive tapes tailored for industrial use across EVT (Engineering Validation Test), DVT (Design Validation Test), and PVT (Production Validation Test) phases. Our tapes are engineered to withstand extreme temperatures (up to 260°C–300°C), offering superior heat resistance, insulation, and adhesion for demanding environments.

Die-Cutting Manufacturing Process:

  1. Material Selection: High-performance materials like polyimide (PI) films, silicone-based adhesives, or PTFE-coated glass fiber are chosen based on thermal and mechanical requirements.

  2. Precision Die-Cutting: Using computer-controlled CNC machines for intricate shapes and sizes (e.g., ±0.1mm tolerance). Includes kiss-cutting, sheet-cutting, or multi-layer laminating.

  3. Post-Processing:

    • Surface Treatment: Plasma coating or silicone adhesion promotion for enhanced bonding.

    • Lamination: Applying fluoroplastic release liners or anti-stick layers.

    • Curing: Multi-stage oven drying (e.g., 120°C–180°C cycles) to optimize adhesion and durability.

Cost-Saving Advantages:

  • Minimal Waste: Nesting algorithms maximize material utilization (e.g., reducing scrap by 20–30%).

  • Process Efficiency: Eliminates secondary bonding steps (e.g., replacing painting processes with self-adhesive tapes).

  • Custom Sizes: Avoids over-ordering with tailored dimensions (e.g., widths from 8mm to 1,250mm).

Quality Control & Delivery:

  • Rigorous Testing: Peel strength (e.g., ≥22N/100mm), thermal aging (e.g., 400°C/1,000h stability), and dielectric performance.

  • Fast Turnaround: Samples in 1–3 days, mass production in 3–7 days.

  • Certifications: Compliance with ISO standards and industry-specific requirements (e.g., semiconductor-grade cleanliness).

Industrial Applications:

  • Electronics: PCB soldering masking, battery insulation, and chip protection during cutting/grinding.

  • Automotive: Gasketing, vibration damping, and dashboard bonding.

  • Manufacturing: Non-stick surfaces for rollers, heat sealing, and composite molding.

MFGsourcing ensures reliability from prototyping to mass production, reducing downtime and enhancing product longevity. Contact us for tailored solutions that meet your exact specifications! 🌟

Payment Terms︰T/T, Alipay, Paypal, WeChat
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