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Custom Die Cut Heat Resistant Tape for Electronics Manufacturing

  •  Custom Die Cut Heat Resistant Tape for Electronics Manufacturing
  •  Custom Die Cut Heat Resistant Tape for Electronics Manufacturing
  •  Custom Die Cut Heat Resistant Tape for Electronics Manufacturing
  •  Custom Die Cut Heat Resistant Tape for Electronics Manufacturing
Model No.︰MGF-220825
Brand Name︰MFG
Country of Origin︰China
Unit Price︰US $ 0.5 / pc
Minimum Order︰3000 pc
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Product Description

In the demanding world of electronics manufacturing, MFGsourcing delivers high-performance custom die-cut heat resistant tapes that ensure reliability from EVT (Engineering Validation Test) through DVT (Design Validation Test) to PVT (Production Validation Test) phases. Our tapes withstand extreme temperatures (up to 204°C) 10, providing superior insulation, vibration damping, and electrical resistance for critical applications across automotive, aerospace, telecommunications, medical devices, and industrial controls 27. By optimizing our manufacturing processes, we guarantee 30% cost savings, rapid delivery, and unmatched quality consistency.

⚙️ Detailed Manufacturing Process:

  1. Material Selection: Premium raw materials like silicone-coated fiberglass , PET films , or acrylic foam are chosen for thermal stability (up to 1800°F/982°C in some grades) and dielectric strength.

  2. Precision Die-Cutting: Using advanced (etching knife) technology 5 or round knife machines, tapes are custom-cut into complex shapes (e.g., circles, pads, irregular outlines) with minimal deformation. For ultra-soft tapes, a reverse(reverse cutting) process is employed: first peeling the release film, then cutting the adhesive layer, and finally applying a new release film to preserve integrity.

  3. Heat Treatment: For high-temperature grades, heated molds 5 or post-production curing ensure adhesive stability under thermal stress, with some tapes exhibiting <2% thermal weight loss at 200°C .

  4. Quality Inspection: Each batch undergoes rigorous checks for dimensional accuracy, adhesion strength (e.g., ≤0.5N/20mm after heat exposure 9), and dielectric performance.

🧼 Post-Process Handling:

  • Thermal Release Lining: Optional heat-release films 3 enable clean, residue-free removal after reflow soldering or other thermal processes.

  • Packaging: Custom packaging (e.g., individual (plastic bag packaging), rolls, or sheets) ensures protection during shipping and ease of use on production lines.

💰 Cost & Efficiency Advantages:

  • 30% Cost Saving: Achieved through material optimization (reducing waste via precision die-cutting), in-house converting , and high-volume production efficiencies.

  • Rapid Delivery: 48-hour sample turnaround and 3-5 day production cycles 4 for urgent prototyping and mass production needs.

  • Quality Assurance: Consistent performance validated by international standards (e.g., UL, Reach, ROHS) and compliance with industry-specific requirements (e.g., automotive ISO 9001/13485/TS 16949).

🌍 Industry Applications:

  • Automotive Electronics: Bonding battery modules, insulating power semiconductors.

  • Consumer Electronics: Securing components in smartphones, CPUs, and wearables.

  • Aerospace & Medical: Critical thermal interface materials for avionics and medical devices.

  • Industrial Automation: Protecting PCB assemblies in high-heat environments .

Choose MFGsourcing for die-cut solutions that enhance product reliability, streamline production, and reduce total cost. Contact us today for a customized quote and experience the difference of working with a strategic supplier!

 

Payment Terms︰T/T, Alipay, Paypal, WeChat
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